VIA announces fanless quad core ARM-based industrial system

VIA announced the AMOS-820, an ultra-compact, fanless system designed around the tiny VIA VAB-820 Pico-ITX board. The VIA AMOS-820 provides embedded customers with a ruggedized system that delivers advanced processing power in an extremely power efficient design for a diversified range of industrial automation, transportation, HMI, and energy management applications.

Featuring a 1.0GHz Freescale i.MX 6Quad ARM Cortex-A9 SoC with three integrated GPUs, the VIA AMOS-820 is optimized for both performance and power to meet the high-end demands of advanced industrial and in-vehicle applications. Boasting a ruggedized, fanless system design with a wide operating temperature range from -20°C up to 65°C, the VIA AMOS-820 delivers a typical power consumption of a mere 7W TDP and offers support for Embedded Linux, Windows Embedded Compact 7 (WEC 7), and Android operating systems. Featuring capture-in support and optional 3G connectivity, the VIA VAB-820 is also ideal for surveillance and features PoE (Power over Ethernet) support for seamless integration.

VIA AMOS-820

"The VIA AMOS-820 further extends our market leadership in ruggedized ARM-based embedded systems," said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. "The combination of quad core processing and ultra-low power consumption provides an exciting combination for customers to create innovative compact connected devices."

VIA AMOS-820
The VIA AMOS-820 combines a 1.0GHz Freescale i.MX 6Quad ARM Cortex-A9 SoC with three independent, integrated GPUs, creating a completely fanless system for even the most computing-intensive of environments within a robust chassis measuring 15cm x 4.6cm x 10.8cm (W x D x H).

On-board storage includes 4GB of eMMC Flash and can be expanded through one MicroSD card slot. Comprehensive I/O functions on the front and rear panels make the VIA AMOS-820 a flexible solution for a wide range of embedded applications. Front I/O includes two COM ports, one DIO port, two CAN ports, one USB 2.0 port and one Micro USB 2.0 OTG port as well as Line-in/out and Mic-in, while rear I/O includes one HDMI port, one composite RCA jack, one GigaLAN port, one MicroSD slot and two USB 2.0 ports. Optional 3G/WiFi is available which can be supported through on-board USB pin-headers or Mini PCIe slot.


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