Montage Technology has introduced the industry's first production dual-mode DDR4

Montage Technology has introduced the industry's first production dual-mode DDR4 Registering Clock Driver (RCD) that supports both Registered Dual In-line Memory Module (RDIMM) and Load Reduced DIMM (LRDIMM) modes for use in next generation server platforms. The RCD is fully compliant with the JEDEC 0.92 specification which defines a single central RCD device that can be used independently on a RDIMM or in conjunction with nine Data Buffers (DB) on an LRDIMM.

Montage has delivered DDR4 RDIMMs and LRDIMMs to key industry players from multiple DRAM suppliers. "Intel has been working with memory ecosystem partners to enable DDR4," said Geof Findley, Director of Memory Enabling and Apps Engineering at Intel, "and the Montage buffer is the first JEDEC 0.92 compliant part running on 32GB Quad Rank x4 DDR4 LRDIMMs providing higher capacity and lower power memory solutions."

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"Montage is pleased to be a partner with Intel in providing the next generation DDR4 memory solutions," said Stephen Tai, President of Montage Technology Group. The new DDR4 JEDEC architecture is the first industry standard to enable a common central RCD for both RDIMMs and LRDIMMs thereby maximizing scalability in next generation servers. The new JEDEC standard LRDIMM architecture also provides a compelling advantage as each data byte lane is isolated or buffered allowing higher speed operation than capable on a standard RDIMM.

Production candidate customer samples of the DDR4 Register, Montage part number M88DDR4RCD01, are available now in a 253-ball Flip-Chip Fine-Pitch BGA package. The DDR4 Data Buffer, M88DDR4DB01, is also available now in a 53-ball Flip-Chip Fine-Pitch BGA package.

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