Power-efficient computing platforms developer VIA Technologies, Inc, today announced the launch of VIA Springboard, a platform developed to provide embedded developers, start-ups, and DIY enthusiasts with the tools for prototyping next-generation ARM-based smart connected devices and taking them to mass-production.
“The growing availability of affordable open hardware platforms is leading to an explosion of exciting new concepts for innovative new connected devices, but taking a great idea from a prototype to mass production remains a major challenge with many such projects,” commented Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “Our goal with VIA Springboard is to provide highly stable and scalable development platforms backed up by a comprehensive range of hardware and software support services that will enable them to reduce new system development costs and speed up their time to market.”
VIA Springboard provides a tightly-integrated platform of hardware kits, Android and Linux software development packages, and support services that covers all stages of the development process, including rapid system prototyping, application development, hardware and software customization, and pre-production testing and diagnostics. With a three-year longevity guarantee, VIA Springboard platforms will be available throughout the entire product life cycle.
VIA Springboard Kits are available for global purchase in two configurations at www.viaspringboard.com. The VIA VAB-600 Springboard Kit features an ultra-compact VIA VAB-600 Pico-ITX board with an I/O extender card, A/C adaptor, and COM and USB cables, and is priced at US$99. The VIA VAB-600 Springboard WiFi Kit also includes a USB WiFi module and is priced at $129.